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Endicott Interconnect Technologies in Endicott, NY received $105.6 million in recent contract modifications from the US Department of Defense for high-performance computer components.

Under the contract modifications, the firm will supply card frame assemblies for high-performance computing application and printed circuit boards and organic substrates for next-generation super computer application.

Below is a list of announced contracts and contract modifications that Endicott Interconnect has received for high-performance computing components, which it has been providing to the DoD since 2007…

Contracts and Key Events

Dec 14/09: $50.3 million contract modification from DoD to produce card frame assemblies for high-performance computing application. In addition, the company received a $15.8 million contract modification for spares in support of the high-performance computing program sustainment.

Previous orders under this contract include production of HyperBGA organic semiconductor packaging, multi-chip module assemblies, printed circuit boards, functionally tested circuit board assemblies and engineering services in support of the program. The contract modifications provide for the close out of these products, including spares, as well as sustainment work on all modules, assemblies, and substrates for the life of the product. The contract value to date is $432 million.

Dec 14/09: $39.5 million research and development contract modification from DoD for phase 2 development of electronic packaging technologies, including printed circuit boards and organic substrates for next-generation super computer application.

This contract, originally announced in December 2008 (see Dec 4/08 entry), supports the exploration and development of advanced, high speed, electronic packaging technologies; specifically system development, printed circuit board and substrate design along with the evaluation of alternative material sets.

Dec 4/08: $12 million research and development contract from DoD to develop electronic packaging technologies, including printed circuit boards and organic substrates for super computer application.

Oct 15/08: Endicott Interconnect Technologies received accreditation from the Defense Microelectronics Activity (DMEA) as a trusted source for integrated circuits for packaging/assembly services to the DoD and other US government users.

May 6/08: $148.6 million contract modification from DoD for the continuation of the current program to produce card frame assemblies, including HyperBGA organic semiconductor packaging, multi-chip module assemblies, printed circuit boards, functionally tested circuit board assemblies and engineering services in support of high-performance computing application. This contract modification period of performance is May to December 2008.

Aug 21/07: $19 million contract modification from DoD to existing work for additional multi-chip module (MCM) assemblies and equipment in support of high-performance computing application.

May 29/07: $49 million follow-on production contract from DoD that includes a $5 million contract for research and development of electronics packaging technologies, including printed circuit boards (PCBs) and substrates for the next-generation of high productivity computing.

This contract serves as the 1st of a 3-phased, 5-year program for Endicott Interconnect to research high-speed electronics technologies for DoD. Phase 1 includes system development and preliminary PCB and substrate design along with fabrication of test vehicles for evaluating alternative material sets. Phase 2 and 3 will be addressed in follow-on awards that encompass modifications to existing facilities to accommodate next-generation processing equipment for advanced technology, PCBs, substrates and assembly.

March 23/07: multiple contracts totaling $164 million from DoD to produce card frame assemblies, including organic semiconductor packaging, module assemblies, printed circuit boards (PCBs), full functionally tested circuit board assemblies and engineering services in support of high-performance computing application.

Early engineering and development effort during the prototype phase of the program lead to the module assembly business as well and the initial $6.5 million contract. Subsequent development and collaboration lead to additional technical scope for follow-on contracts. This included PCB fabrication, complex board assembly and integration into card frame subsystems.

Contracts totaling $37.5 million were awarded for certification of the product, which included building the formal qualification parts and all related documentation, reporting, quality and reliability requirements. The remaining $120 million contract was awarded for the first production order of fully integrated card frame assemblies to be delivered by year end.