$105.6M to Endicott Interconnect for US DoD High-Performance Computer Components

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Endicott Interconnect Technologies in Endicott, NY received $105.6 million in recent contract modifications from the US Department of Defense for high-performance computer components. Under the contract modifications, the firm will supply card frame assemblies for high-performance computing application and printed circuit boards and organic substrates for next-generation super computer application. Below is a list of announced contracts and contract modifications that Endicott Interconnect has received for high-performance computing components, which it has been providing to the DoD since 2007… Contracts and Key Events Dec 14/09: $50.3 million contract modification from DoD to produce card frame assemblies for high-performance computing application. In addition, the company received a $15.8 million contract modification for spares in support of the high-performance computing program sustainment. Previous orders under this contract include production of HyperBGA organic semiconductor packaging, multi-chip module assemblies, printed circuit boards, functionally tested circuit board assemblies and engineering services in support of the program. The contract modifications provide for the close out of these products, including spares, as well as sustainment work on all modules, assemblies, and substrates for the life of the product. The contract value to date is $432 million. Dec 14/09: $39.5 million research and development contract modification from DoD […]

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